Flexible printed circuit (FPC) boards use a thin flexible polyimide substrate instead of rigid FR-4. FPC can bend, fold and flex without breaking, making it ideal for compact and moving electronics.

FPC Key Features:
- Ultra-thin and lightweight construction.
- Bending radius allows dynamic flexing.
- Reliable connections in tight spaces.
- Reduced assembly and wiring cost.

FPC Materials:
- Base film: polyimide (PI) or polyester (PET).
- Conductor: rolled annealed copper (RA) or electrodeposited copper (ED).
- Coverlay and adhesive protect the traces.
- Stiffeners add support at connector areas.

FPC Applications:
- Smartphones, wearables and cameras.
- Foldable and flexible displays.
- Automotive lighting and sensors.
- Medical devices and aerospace.

Compared to rigid PCB, FPC saves space, reduces weight and improves reliability under vibration. Choose FPC when your design needs thin, flexible and dynamic interconnects.