HDI PCB stands for high-density interconnect, a PCB with smaller lines, finer pads and stacked microvias. HDI boards use blind and buried vias to connect inner layers directly, which saves space and enables more routing in a smaller footprint.

HDI PCB Structure:
- Microvia layers with laser-drilled blind vias.
- Buried vias between inner layers.
- Fine-line copper traces (down to 0.075 mm).
- Multi-layer lamination with stacked or staggered vias.

Key Advantages:
- Higher routing density in a compact size.
- Shorter signal paths for better high-speed performance.
- Blind and buried vias free up board surface area.
- Better signal integrity for dense digital designs.

HDI PCB Applications:
- Smartphones and tablets.
- Wearable devices and medical electronics.
- High-performance computing and networking.
- Automotive ADAS and 5G modules.

Choose HDI PCB when you need maximum functionality in a small, high-performance board with blind and buried via technology.