Thermal design is critical for power electronics. Heat kills components.

Heat Dissipation Methods:
1. Thermal Vias: 0.3mm vias in arrays under hot components.
2. Copper Pour: Increase copper area. Use 2oz+ copper.
3. Heat Sinks: Aluminum sinks on power ICs. Use thermal paste.
4. Airflow: Design for convection or add fans.
5. Thermal Pads: Exposed pads with vias to ground plane.

Design Tips: Keep hot parts away from sensitive components. Calculate thermal resistance (Rth). Add temperature test points.

Good thermal design prevents overheating and extends product life.