Reflow soldering is the process that melts solder paste to permanently join SMT components to PCB pads inside a reflow oven. It is the standard soldering method for surface mount assembly.

Reflow Soldering Process:
- Solder paste is applied to the PCB pads.
- Components are placed onto the pasted pads.
- The board passes through the reflow oven.
- Solder paste melts and forms reliable joints.

Temperature Profile:
- Preheat zone raises the board gradually.
- Soak zone activates the flux.
- Reflow peak melts the solder (around 250 C).
- Cooling zone solidifies the joints.

Key Advantages:
- Uniform heating across the whole board.
- High throughput for mass production.
- Reliable, repeatable solder joints.
- Supports fine-pitch SMT components.

Reflow soldering delivers fast, precise and reliable soldering for modern SMT PCB production.